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Shu-Jen Han Top-Executive

Proven track record of advanced technology development serving as a technical leader as well as building and managing a large R/D organization. Built high quality (both technical and cultural) teams with multidisciplinary functions. Led full-cycle technology development from the device exploration stage to the final product stage


Connections

Headquarters: New York City Metropolitan Area
Headline: CTO @ SEEQC (chip-based quantum computer)
Followers: 1755
Connections: 1629
Company: SeeQC
Company Website: https://seeqc.com/
Languages: English, Mandarin
Skills: CMOS, Semiconductors, Nanotechnology, Semiconductor Industry, Materials Science, Engineering, Project Management, Characterization, Thin Films, Nanomaterials, Sensors, Nanofabrication, Bioelectronics, Patents, Physics, Design of Experiments, Failure Analysis, Process Integration, Circuit Design, R&D, Labview, Matlab, LabVIEW, AFM, IC, Simulations, Research and Development (R&D), Integrated Circuits (IC), Patent Law
Experience: Title: Chief Technology Officer Company: SEEQC Location: Start: Mar 2025 End: Present Title: VP of Engineering Company: SEEQC Location: Start: May 2021 End: Mar 2025 Title: Associate Vice President Company: HFC Semiconductor Corp. Location: Start: Mar 2021 End: May 2021 Title: Senior Director Company: HFC Semiconductor Corp. Location: Start: 2019 End: Mar 2021 Title: Director, Advanced Memory Technology Company: HFC Semiconductor Corp. Location: Start: 2017 End: 2019 Title: Manager, Nanoelectronics Company: IBM T. J. Watson Research Center Location: Start: 2007 End: 2017
Education: School: Stanford University Degree: Ph.D. Field: Materials Sci. Eng. /Ph.D. Minor: Electrical Eng. /M.S.: Materials Sci. Period: 2002 - 2007 School: National Tsing Hua University (Taiwan) Degree: Bachelor of Science (B.S.) Field: Period: 1996 - 1999
Publications: link to publication/patent list (see below link) ()
Awards: IBM Outstanding Technical Achievement Award (OTAA), 3 times | Jan 2017 | Pat Goldberg Best Paper Award | Jan 2016 | IBM Master Inventor (3-year term), 2 times | Jan 2015 | IBM Research Division Award | Jan 2015 | IBM Invention Achievement Award | Jan 2008 | IEEE IEDM Roger A. Haken Award | Jan 2006 | IBM Invention Plateau Awards, 29 times (each for 4 filed US patents) | |
Country: United States