Director of Engineering at Winbond Electronics Current Job Duration: 2 yrs 6 mos (until March 2026) HEADLINE: Memory professional PERSONAL SUMMARY: Dedicated DRAM and CMOS circuit design pforessional with 29 year experience in Major Memory companies. Led DRAM design in SAMSUNG, SK-Hynix (1G LPDDR2, 4G LPDDR4, 512M SDRAM) Designed SRAM products in IDT (18M ZBT SRAM, 32K X 32K TSIS) Languages:...